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NA-1500

Plasma ashing system for FO-PLP. The NA-1500 plasma ashing system is designed specifically to handle the larger substrates required in fan-out panel level packaging.

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SMV-500F

The ULVAC SMV-500F sputtering system is used for seed layer (Ti/Cu) PCB interposers.

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SIV Series

Vertical Deposition results in low particle generation.

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