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NA-8000
Luminous NA series ashing systems can be used for all sizes of wafers and is compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.
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NA-1300
The NA-1300 ashing system can be used for 200 and 300mm wafers and is compatible with a wide range of processes from critical processes for next generation wafers to wafer level packaging processes.
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NA-1500
Plasma ashing system for FO-PLP. The NA-1500 plasma ashing system is designed specifically to handle the larger substrates required in fan-out panel level packaging.
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