Description
The NA-1500 is the perfect tool for large FO-PLP applications and capable of removing resist, plasma cleaning, and surface modification (hydrophobicity to hydrophilicity). With key features such as a high removal rate (greater than 1.5 um/min) for photoresist and a low temperature process capabilities this is an excellent tool for panel level packaging solutions.
Applications
- Normal Ashing (Resist, polyimide)
- Residue Removal
- Organic Film Etching
- Plasma Cleaning
- Surface Modification
Key Features
- 2 process modules, 2 cassettes, Atmospheric robot
- Square Substrate size ~500mm (larger sizes avaialable)
- Low temperature process - <140C
- High Ashing Rate - >1.5um/min (photoresist)
- Uniformity - <+/- 10% (edge exclusion 10mm)
Need more information?
At ULVAC, we understand that finding the right product is crucial for optimizing your processes, whether you're scaling up production or maintaining precision in your systems. With our wide range of cutting-edge vacuum technologies and in-depth expertise, we will guide you through selecting the ideal solution tailored to your unique requirements.
Contact ULVAC System Sales & Support For inquiries outside North and South America, please contact ULVAC Corporate
