Key Features
- High-density plasma process on 27.12MHz
- Supports the deposition of SiH4 (SiO2, SiNx, SiON, a-Si ) and TEOS (SiO2)
- Supports the chamber cleaning by CF4+O2 plasma
- Supports the heater for low-temperature deposition of organic EL
- Supports various substrate sizes
- Vacuum box-enabled indirect sequential processing within C-series (Sputter: CS-200, Evaporation: CV-200)
Applications
- Power devices
- Compound-related devices of LED, LD and highspeed devices
- Organic EL system for R&D use
- Solar battery system for R&D use
- MEMS
Need more information?
At ULVAC, we understand that finding the right product is crucial for optimizing your processes, whether you're scaling up production or maintaining precision in your systems. With our wide range of cutting-edge vacuum technologies and in-depth expertise, we will guide you through selecting the ideal solution tailored to your unique requirements.
Contact ULVAC System Sales & Support For inquiries outside North and South America, please contact ULVAC Corporate