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ENTRON-EXX

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The ENTRON-EXX is a versatile, multi-chamber platform designed to support the production of a wide variety of cutting-edge products, including semiconductor logic, memory (DRAM, NAND, next-generation non-volatile memory), and packaging. By integrating a variety of process modules, such as PVD, pre-clean, heating, cooling with enhanced data collection and analysis capabilities, the ENTRON-EXX provides customers with an optimized environment for both development and mass production.

Built for next-generation semiconductor innovation, the ENTRON-EXX is a cutting-edge multi-chamber deposition platform that elevates productivity, flexibility, and intelligence. With Single or Tandem configurations, it maximizes factory space and boosts throughput per square foot. Its modular architecture lets you add or swap up to 12 PVD, pre-clean, heating, or cooling modules, perfect for evolving process demands.

Real-time data capture and analytics empower smarter maintenance, improved yields, and operational efficiency. Plus, simplified plug-in connections cut relocation and setup time by 50%, while its eco-conscious design trims standby power use by ~20% and shrinks clean-room footprint by up to 10%. The ENTRON-EXX sets the standard for scalable, sustainable sputtering performance.

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By integrating a variety of process modules such as PVD, pre-clean, heating, cooling with enhanced data collection and analysis capabilities, the ENTRON-EXX provides customers with an optimized environment for both development and mass production.

The ENTRON-EXX sets the standard for scalable, sustainable sputtering performance.

Features

  • Offers two versatile platform options, Single and Tandem*, enabling customers to select the best platform to fit their factory spaces, thereby achieving maximum productivity per unit of space.
  • Enables quick module additions and swaps, providing flexibility to adapt to changing needs.
  • Capable of accommodating up to 12 modules (PVD, pre-clean, heating, cooling)
  • Enhanced data collection and analysis capabilities to improve yield, support preventive maintenance, and drive operational efficiency.
  • A Single platform features a single transfer chamber (Core), offering a simple and space-efficient design. A Tandem platform features two transfer chambers (Cores) arranged in sequence, ideal for complex processes that require higher productivity.

Applications

  • Fabrication of semiconductors: Logic, DRAM, NAND, NVM
  • Deposition processes for semiconductor fabrication, including metal interconnects, patterning masks, electrodes, and other functional films.

Technical Bulletin

High vacuum L-type valve (XLA, XLC) series

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