Don't Sacrifice Production for Floorspace
Combined with fast new wafer handling robotics, ENVIRO-Optima's straightforward design results in the highest throughput with the smallest footprint (67wph/m2) for systems under $1 million.
ENVIRO Offers the Flexibility for Multiple Applications
- Descum
- Thick resist strip (including: SU-8, KMPR, silanated)
- Polymer and residue removal
- MEMS Release (organic sacrificial layer removal)
- Backside clean (bevel/edge)
ENVIRO Offers a Wide Process Operating Range
- Ashing Rate – Several nm/min to more than 10um/min
- Wide range of stage temperature control (hot plate or optional cold plate)
- High efficiency downstream plasma source
- Up to 4 MFC’s, 2 standard, 2 optional
- Gas chemistries: various, including halogen bearing
Need more information?
At ULVAC, we understand that finding the right product is crucial for optimizing your processes, whether you're scaling up production or maintaining precision in your systems. With our wide range of cutting-edge vacuum technologies and in-depth expertise, we will guide you through selecting the ideal solution tailored to your unique requirements.
Contact ULVAC System Sales & Support For inquiries outside North and South America, please contact ULVAC CorporatePlasma Source Options
 MW Downstream Plasma Source |
 Remote ICP Plasma Source |
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